pk 524 (v1.1 ) n ovember 2 , 2012 www.xilinx.com 1 pk 5 46 ( v 1 . 1 ) n ovember 2 , 201 2 100% material declaration data sheet for 7 series f bg900 average weight: 3.7865 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.296758 7.837 silicon (si) 7440 - 21 - 3 100.00 basis 0.296758 solder bump 0.0193 09 0. 510 tin (sn) 7440 - 31 - 5 63.00 0.01216 5 lead (pb) 7439 - 92 - 1 37.00 0.00714 4 solder paste 0.071000 1.875 tin (sn) 7440 - 31 - 5 96.50 basis 0.068515 silver (ag) 7440 - 22 - 4 3.00 basis 0.002130 copper (cu) 7440 - 50 - 8 0.50 basis 0.000355 capacitor 1 0.0 11700 0.309 batio3 type 12047 - 27 - 7 70.60 ceramic 0.008260 nickel (ni) 7440 - 02 - 0 6.70 inner electrode 0.000784 copper (cu) 7440 - 50 - 8 20.10 outer electrode 0.002352 nickel (ni) 7440 - 02 - 0 0.80 plating 1 0.000094 tin (sn) 7440 - 31 - 5 1.80 plating 2 0.000211 capacitor 2 0.00 9200 0.243 batio3 type 12047 - 27 - 7 51.10 ceramic 0.004701 copper (cu) 7440 - 50 - 8 27.00 inner electrode 0.002484 nickel (ni) 7440 - 02 - 0 16.90 outer electrode 0.001555 nickel (ni) 7440 - 02 - 0 2.00 plating 1 0.000184 tin (sn) 7440 - 31 - 5 3.00 plating 2 0.000276 capacitor 3 0.002400 0.063 batio3 type 12047 - 27 - 7 66.00 ceramic 0.001584 nickel (ni) 7440 - 02 - 0 2.67 inner electrode 0.000064 copper (cu) 7440 - 50 - 8 23.33 outer electrode 0.000560 nickel (ni) 7440 - 02 - 0 2.33 plating 1 0.000056 tin (sn) 7440 - 31 - 5 5.67 plating 2 0.000136 ? copyright 201 2 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet C 7 series fb g900 pk 546 (v1.1 ) n ovember 2 , 2012 www.xilinx.com 2 component substan ce description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total underfill 0.053000 1.400 bisphenol f/ epichlorohydrin copolymer 9003 - 36 - 5 20.00 basis 0.010600 phenolic resin trade secret 15.00 basis 0.007950 bisphenol a type liquid epoxy resin 25068 - 38 - 6 5.00 basis 0.002650 amine type accelerator trade secret 5.00 basis 0.002650 silicon dioxide 60676 - 86 - 0 51.50 basis 0.027295 carbon black 1333 - 86 - 4 1.00 basis 0.000530 additives trade secret 2.50 additive 0.001325 solder ball 0.751829 19.855 tin (sn) 7440 - 31 - 5 96.50 main material 0.725515 silver (ag) 7440 - 22 - 4 3.00 main material 0.022555 copper (cu) 7440 - 50 - 8 0.50 main material 0.003759 substrate 2.5713 0 5 67.908 copper (cu) 7440 - 50 - 8 37.42 0.962228 tin ( sn ) 7440 - 31 - 5 0.92 0.023579 lead ( pb ) 7439 - 92 - 1 0.19 0.004937 silver ( ag ) 7440 - 22 - 4 0.02 0.000463 bt core n/a 48.05 1.235150 abf n/a 10.92 0.280665 solder mask n/a 2.51 0.064283
100% material declaration data sheet C 7 series fb g900 pk 546 (v1.1 ) n ovember 2 , 2012 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently veri fied the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 03 / 23 /201 2 1.0 initial xilinx release. 1 1 / 0 2/2012 1.1 update substrate component.
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